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To lead and execute development activities for Front-of-Line (FOL) semiconductor packaging processes, with a focus on continuous improvement, cost efficiency, yield enhancement, and new technology introductions. This role involves cross-functional collaboration to drive process development from concept to qualification and release for mass production.
JOB DUTIES AND RESPONSIBILITIES
1. Power Package and Module Development
Lead the
end-to-end design and development
of high-power discrete and power module packaging technologies.
Define product requirements and translate customer needs into
Package Requirement Specifications (PRS)
and
Supplier Component Documents (SCD)
.
Collaborate with designers and process engineers to define internal/external structure, material selection, and optimized assembly flows.
Ensure robust manufacturability by applying
DFM principles
and maintaining alignment with quality and cost targets.
Generate key documentation:
DFMEA, control plans, QFD, process FMEA, LAR plans
, technical procurement spec etc.
Manage characterization and qualification phases to ensure design meets
electrical, thermal, and reliability goals
.
Own project schedules, deliverables, and risk mitigation across all NPI phases.
Manage package prototyping/proof of concept, qualification, and transition to high volume manufacturing.
Lead technical reviews and gate milestones to ensure on-time development and HVM readiness.
Coordinate with cross-functional stakeholders (BU, quality, application, manufacturing) for technical alignment and execution.
Drive problem-solving processes (e.g., 8D, RCCA) to overcome design and process challenges.
Systematic approach in compliances with the NPI stipulated events/actions deliverable.
3. Leadership and Technical Influence
Mentor junior engineers and contribute to building a strong internal technical roadmap.
Support continuous improvement and best practice sharing across development teams.
Participate in customer technical discussions and support qualification/audit efforts where needed.
TECHNICAL SKILLS & COMPETENCIES
Minimum 5 years of experience
in power module or high-power discrete package development, including hands-on NPI leadership.
Strong understanding of multiple disciplines in FOL processes including SiC wafer dicing, heated DA process application, Cu/Ag wire & ribbon bonding, Solder reflow, gel-filled modules, and thermal/electrical design considerations etc.
Ability to develop technology roadmap align with WBG packaging evolvement
TOP 5 GENERIC SKILLS & COMPETENCIES
Experience with
device-package interaction
, material selection, and reliability standards (e.g., JEDEC, AEC-Q100).
Skilled in the use of tools such as
AutoCAD, JMP, Minitab
, and proficiency in MS Office and technical presentations.
Strong communication and cross-functional collaboration skills.
Self-driven, open-minded, problem solver with a proactive mindset.
Risk based thinking in carrying out development roles.
