Technician or Senior (Underfill/DA/Testing)

Job Responsibilities

  • Perform die attach, underfill, and semiconductor assembly processes according to work instructions and process specifications.

  • Operate, setup, and monitor production machines and equipment.

  • Conduct product testing, visual inspection, and quality checks to ensure compliance with production standards.

  • Support troubleshooting activities for process and equipment-related issues.

  • Monitor process parameters and report abnormalities to engineers or supervisors.

  • Perform routine maintenance and housekeeping of equipment and workstations.

  • Ensure proper handling of materials and products in compliance with ESD and cleanroom requirements.

  • Record production data, inspection results, and machine performance accurately.

  • Assist engineers in process improvement and yield enhancement activities.

  • Follow all safety, quality, and company regulations.

Requirements

  • Certificate/Diploma in Engineering, Electronics, Mechatronics, Semiconductor Technology, or related field.

  • Minimum 1–2 years of experience in semiconductor manufacturing or assembly environment is preferred.

  • Knowledge in die attach, underfill, wire bonding, or semiconductor testing processes will be an added advantage.

  • Able to work in cleanroom environment and shift rotation if required.

  • Basic understanding of ESD handling and quality control procedures.

  • Good teamwork, communication, and problem-solving skills.

Preferred Skills

  • Die Attach Process

  • Underfill Dispensing

  • Semiconductor Packaging

  • Functional Testing

  • Optical Inspection

  • Equipment Troubleshooting

  • Process Monitoring

  • Yield Improvement

  • ESD Control

  • Cleanroom Practices

  • SPC / QC Tools
  • Machine Operation & Setup

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